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TLV2772IDGK

Descrizione:
TLV2772IDGK datasheet pdf and Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product details from Rochester Electronics stock available at Rozee
Categoria:
Circuiti integrati (CI)
Specifiche
Part Number:
TLV2772IDGK
Manufacturer:
Rochester Electronics
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa MoneyGram Western Union
More Information:
TLV2772IDGK More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$1.68
Remark:
Manufacturer: Rochester Electronics. Rozee is one of the Distributors. Wide range of applications.
Width:
3 mm
Length:
3 mm
Packaging:
Rail/Tube
Thickness:
970 µm
Voltage Gain:
113.06 dB
Output Current:
50 mA
Power Dissipation:
424 mW
Max Supply Voltage:
6 V
Number of Channels:
2
Number of Elements:
2
Nominal Supply Current:
4 mA
Min Dual Supply Voltage:
1.25 V
Operating Supply Voltage:
3 V
Min Operating Temperature:
-40 °C
Output Current per Channel:
50 mA
Nominal Gain Bandwidth Product:
4.8 MHz
Products Category:
Integrated Circuits (ICs) - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Qty:
5806 In Stock
Applications:
TV Wearables (non-medical) Datacom module
Height:
1.07 mm
Bandwidth:
5.1 MHz
Slew Rate:
9 V/µs
Case/Package:
VSSOP
Number of Pins:
8
Max I/O Voltage:
2.5 mV
Input Bias Current:
60 pA
Min Supply Voltage:
2.5 V
Number of Circuits:
2
Gain Bandwidth Product:
5.1 MHz
Max Dual Supply Voltage:
3 V
Operating Supply Current:
1 mA
Max Operating Temperature:
125 °C
Input Offset Voltage (Vos):
2.5 mV
Common Mode Rejection Ratio:
60 dB
Numero di modello:
TLV2772IDGK
Introduzione
TLV2772IDGK Overview\\\\nTLV2772IDGK is a model belonging to the Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have TLV2772IDGK high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and
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